cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 1/7 BTB1184J3S cystek product specification low vcesat pnp epitaxial planar transistor BTB1184J3S features ? low v ce (sat) ? excellent current gain characteristics ? rohs compliant and halogen-free package symbol outline BTB1184J3S to-252(dpak) b base c collector e emitter bv ceo -50v i c -3a r cesat 130m b c e ordering information device package shipping to-252 BTB1184J3S-s-t3-g (rohs compliant and halogen-free package) 2500 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t3:2500 pcs/tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 2/7 BTB1184J3S cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -60 v collector-emitter voltage v ceo -50 v emitter-base voltage v ebo -6 v collector current(dc) i c -3 collector current(pulse) i cp -7 *1 a power dissipation (t a =25 ) pd(t a =25 ) 1 power dissipation (t c =25 ) pd(t c =25 ) 15 *2 w thermal resistance, junction to ambient r ja 125 thermal resistance, junction to case r jc 8.33 *2 c/w operating junction and storage temperature range tj,tstg -55~+150 c note : *1 . single pulse pw=10ms *2 . printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm or larger. characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -60 - - v i c =-50 a, i e =0 bv ceo -50 - - v i c =-1ma, i b =0 bv ebo -6 - - v i e =-50 a, i c =0 i cbo - - -1 a v cb =-40v, i e =0 i ebo - - -1 a v eb =-4v, i c =0 *v ce(sat) - -0.26 -0.5 v i c =-2a, i b =-0.1a *r ce(sat) - 130 250 m i c =-2a, i b =-0.1a *v be(sat) - -0.96 -1.2 v i c =-2a, i b =-0.1a *h fe 1 200 - - - v ce =-2v, i c =-20ma *h fe 2 270 - 560 - v ce =-3v, i c =-500ma *h fe 3 80 - - - v ce =-2v, i c =-1a f t - 80 - mhz v ce =-5v, i c =-0.1a, f=100mhz cob - 35 - pf v cb =-10v, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of h fe 2 rank s range 270~560
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 3/7 BTB1184J3S cystek product specification recommended soldering footprint
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 4/7 BTB1184J3S cystek product specification typical characteristics current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=1v vce=2v vce=3v saturation voltage vs collector current 1 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vcesat@ic=50ib vcesat=20ib vcesat=30ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) on voltage---vbeon(mv) vbeon@vce=2v power derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 20 40 60 80 100 120 140 160 ambient temperature---ta() power dissipation---pd(w) power derating curve 0 2 4 6 8 10 12 14 16 0 20 40 60 80 100 120 140 160 ambient temperature---ta() power dissipation---pd(w)
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 5/7 BTB1184J3S cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 6/7 BTB1184J3S cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c817j3 issued date : 2015.02.25 revised date : page no. : 7/7 BTB1184J3S cystek product specification to-252 dimension inches millimeters inches marking: style: pin 1.base 2.collector 3.emitter 4.collector 3-lead to-252 plastic surface mount package cystek package code: j3 device n ame date code b1184. 1 2 3 4 hfe rank millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 a1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 b 0.039 0.048 0.990 1.210 h 0.163 ref 4.140 ref b 0.026 0.034 0.660 0.860 k 0.190 ref 4.830 ref b1 0.026 0.034 0.660 0.860 l 0.386 0.409 9.800 10.400 c 0.018 0.023 0.460 0.580 l1 0.114 ref 2.900 ref c1 0.018 0.023 0.460 0.580 l2 0.055 0.067 1.400 1.700 d 0.256 0.264 6.500 6.700 l3 0.024 0.039 0.600 1.000 d1 0.201 0.215 5.100 5.460 p 0.026 ref 0.650 ref e 0.236 0.244 6.000 6.200 v 0.211 ref 5.350 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead : pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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